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power management 1 www.semtech.com sc1453 150ma ultra low dropout regulator with low noise bypass features revision: august 24, 2006 description the sc1453 is a low dropout linear regulator that operates from a +2.25v to +6.5v input range and delivers up to 150ma. a pmos pass transistor allows the low 75a supply current to remain independent of load, making these devices ideal for battery operated portable equipment such as cellular phones, cordless phones and personal digital assistants. the sc1453 has a bandgap reference bypass pin for very low noise operation - a 10nf (typ.) capacitor may be connected between this pin and ground. other features include low powered shutdown, short circuit protection, thermal shutdown protection and reverse battery protection. the sc1453 comes in the tiny 5 lead sot-23 package and the ultra-low profile 5 lead tsot-23. ? battery powered systems ? cellular telephones ? cordless telephones ? personal digital assistants ? portable instrumentation ? modems ? pcmcia cards ? ?2982/5205? compatible pinout ? guaranteed 150 ma output current ? 2% output accuracy guaranteed over line, load and temperature ? very small external components - designed to work with ceramic capacitors ? low 26v rms output noise (1.5v option, c in = c out = 1f, c byp = 10nf) ? very low supply current ? thermal overload protection ? reverse battery protection ? low power shutdown ? full industrial temperature range ? very low profile packaging available (1mm max. height) ? surface mount packaging (5 pin sot-23 and tsot-23) ? available in lead-free packages, fully weee and rohs compliant vin vout c3 1uf c1 1uf u1 sc1453 1 2 3 4 5 in gnd en byp out c2 10nf applications typical application circuit
2 ? 2006 semtech corp. www.semtech.com power management sc1453 absolute maximum ratings r e t e m a r a pl o b m y sm u m i x a ms t i n u e g a t l o v y l p p u s t u p n iv n i 7 + o t 6 . 0 -v t n e i b m a o t n o i t c n u j e c n a t s i s e r l a m r e h t a j 6 5 2w / c e s a c o t n o i t c n u j e c n a t s i s e r l a m r e h t c j 1 8w / c e g n a r e r u t a r e p m e t t n e i b m a g n i t a r e p ot a 5 8 + o t 0 4 -c e g n a r e r u t a r e p m e t n o i t c n u j g n i t a r e p ot j 5 2 1 + o t 0 4 -c e g n a r e r u t a r e p m e t e g a r o t st g t s 0 5 1 o t 5 6 -c . c e s 0 1 ) g n i r e d l o s ( e r u t a r e p m e t d a e lt d a e l 0 0 3c g n i t a r d s ed s e2v k unless specified: v in = v out + 1v, v en = v in , i out = 100a, c in = c out = 1f, t a = 25c. values in bold apply over full operating ambient temperature range. r e t e m a r a pl o b m y ss n o i t i d n o cn i mp y tx a ms t i n u n i e g n a r e g a t l o v y l p p u sv n i 5 2 . 20 5 . 6 v t n e r r u c y l p p u si q i t u o a m 0 5 1 o t a m 0 =5 70 3 1a 0 6 1 v n i v , v 5 . 6 = n e v 0 =1 . 00 . 1a 5 . 1 t u o e g a t l o v t u p t u o ) 1 ( v t u o i t u o a m 1 =% 5 . 1 -v t u o % 5 . 1 +v a m 0 i t u o v , a m 0 5 1 t u o v 1 + v n i v 5 . 5 % 0 . 2 -% 0 . 2 + n o i t a l u g e r e n i l ) 2 ( ) 1 ( g e r ) e n i l ( v ( ) m o n ( t u o ) v 1 . 0 + v n i i , v 5 . 5 t u o a m 1 =5 . 20 1v m 2 1 n o i t a l u g e r d a o l ) 1 ( g e r ) d a o l ( i t u o a m 0 5 1 o t a m 1 . 0 =3 -0 1 -v m 0 2 - electrical characteristics exceeding the specifications below may result in permanent damage to the device, or device malfunction. operation outside of th e parameters specified in the electrical characteristics section is not implied.
3 ? 2006 semtech corp. www.semtech.com power management sc1453 unless specified: v in = v out + 1v, v en = v in , i out = 100a, c in = c out = 1f, t a = 25c. values in bold apply over full operating ambient temperature range. r e t e m a r a pl o b m y ss n o i t i d n o cn i mp y tx a ms t i n u ) . t n o c ( t u o t i m i l t n e r r u ci m i l 0 0 4 a m e g a t l o v t u o p o r d ) 3 ( ) 1 ( v d i t u o a m 1 =1v m i t u o a m 0 5 =0 55 6v m 5 7 i t u o a m 0 0 1 =0 0 15 2 1v m 5 5 1 i t u o a m 0 5 1 =0 5 10 9 1v m 0 3 2 , e s i o n e g a t l o v t u p t u o c t u o f 1 = e n i , z h k 0 0 1 o t z h 0 1 t u o a m 1 = c p y b v , f n 0 1 = t u o v 5 . 1 = 6 2v s m r i , z h k 0 0 1 o t z h 0 1 t u o a m 1 = c p y b v , f n 0 1 = t u o v 3 . 3 = 4 5 , e s i o n e g a t l o v t u p t u o c t u o f 0 0 1 = e n i , z h k 0 0 1 o t z h 0 1 t u o a m 1 = c p y b v , f n 0 1 = t u o v 5 . 1 = 3 1v s m r i , z h k 0 0 1 o t z h 0 1 t u o a m 1 = c p y b v , f n 0 1 = t u o v 3 . 3 = 9 2 o i t a r n o i t c e j e r y l p p u s r e w o pr r s pc , z h 0 2 1 = f p y b f n 0 1 =1 6b d p y b e m i t e s i r p u - t r a t st r c p y b f n 0 1 =3 . 1s m n e d l o h s e r h t t u p n i e l b a n ev h i v 5 2 . 2 v n i v 5 . 6 6 . 1 v v l i v 5 2 . 2 v n i v 5 . 6 4 . 0 t n e r r u c s a i b t u p n i e l b a n e ) 4 ( i n e v 0 v n e v n i 5 . 0 - 0 5 . 0 + a n o i t c e t o r p e r u t a r e p m e t r e v o l e v e l p i r t h g i ht i h 0 5 1c s i s e r e t s y ht t s y h 0 2c notes: (1) low duty cycle pulse testing with kelvin connections required. (2) v in(min) = 2.25v. (3) defined as the input to output differential at which the output voltage drops 100mv below the value measured at a differential of 1v. not measurable on 1.5v and 1.8v parts due to minimum v in constraints. (4) guaranteed by design. electrical characteristics (cont.)
4 ? 2006 semtech corp. www.semtech.com power management sc1453 notes: (1) where xxx denotes voltage options. available voltages are: 1.5v (1.5), 1.8v (1.8), 2.5v (2.5), 2.7v (2.7), 2.8v (2.8), 2.9v (2.9), 3.0v (3.0), 3.1v (3.1), 3.2v (3.2) and 3.3v (3.3). (2) only available in tape and reel packaging. a reel contains 3000 devices. (3) lead free packaging (ordered with suffix extension ?trt?) is optional. consult factory for availability. this product is fully weee and rohs compliant. (4) use when ordering sc1453, 2.85v option, available in lead-free packages only. this product is fully weee and rohs compliant. (5) evaluation board for sc1453. specify output voltage option when ordering. r e b m u n t r a pe g a k c a p r t x x x - k s i 3 5 4 1 c s ) 2 ( ) 1 ( 5 - 3 2 - t o s t r t x x x - k s i 3 5 4 1 c s ) 3 ( ) 2 ( ) 1 ( t r t 5 8 2 k s i 3 5 4 1 c s ) 4 ( ) 2 ( r t x x x - k s t i 3 5 4 1 c s ) 2 ( ) 1 ( 5 - 3 2 - t o s t t r t x x x - k s t i 3 5 4 1 c s ) 3 ( ) 2 ( ) 1 ( t r t 5 8 2 k s t 3 5 4 1 c s ) 4 ( ) 2 ( b v e 3 5 4 1 c s ) 5 ( a / n top view (sot-23-5 & tsot-23-5) # n i pe m a n n i pn o i t c n u f n i p 1n i. n i p t u p n i 2d n g. d e d e e n f i g n i k n i s t a e h r o f d e s u e b n a c . n i p d n u o r g 3n e. d e s u g n i e b t o n f i n i o t t c e n n o c . n i p e l b a n e h g i h e v i t c a 4p y b e c u d e r o t d n g d n a n i p s i h t n e e w t e b ) l a c i p y t ( r o t i c a p a c f n 0 1 a t c e n n o c . s s a p y b e c n e r e f e r . e s i o n t u p t u o 5t u o. a m 0 5 1 o t p u g n i c r u o s , t u p t u o r o t a l u g e r pin configuration ordering information pin descriptions
5 ? 2006 semtech corp. www.semtech.com power management sc1453 block diagram top mark bottom mark marking information x = package (5 for sot-23-5, t for tsot-23-5) 3 = sc1453 xx = voltage option (examples: 5331 for 3.1v option in sot-23-5 yyww = date code (example: 0008 for week 8 of 2000) x3xx yyww top mark yyww yyww = date code (example: 0008 for week 8 of 2000) bottom mark bx00 for sc1453, 2.85v option: x = l for sot-23-5 and n for tsot-23-5
6 ? 2006 semtech corp. www.semtech.com power management sc1453 applications information theory of operation the sc1453 is intended for applications where very low dropout voltage, low supply current and low output noise are critical. it provides a very simple, low cost solution that uses very little pcb real estate. only three external capacitors are required for operation (two if a low noise output is not required). the sc1453 contains a bandgap reference trimmed for optimal temperature coefficient which is fed into the inverting input of an error amplifier. the output voltage of the regulator is divided down internally using a resistor divider and compared to the bandgap voltage. the error amplifier drives the gate of a low r ds(on) p-channel mosfet pass device. an active high enable pin (en) allows the regulator to be shut down. pulling this pin low causes the device to enter a very low power shutdown mode, where it will draw typically 0.1a from the input supply. a bypass pin (byp) is provided to decouple the bandgap reference to reduce output noise and also to improve power supply rejection. this pin can be left open if low noise operation is not required. the regulator has its own current limit circuitry to ensure that the output current will not damage the device during output short, overload or start-up. the current limit is guaranteed to be greater than 400ma to allow fast charging of the output capacitor and high initial currents for dsp initialization. the sc1453 has a fast start-up circuit to speed up the initial charging time of the bypass capacitor to enable the output voltage to come up quicker (typically 1.3ms with c byp = 10nf). the sc1453 includes thermal shutdown circuitry to turn off the device if t j exceeds 150c (typical), with the device remaining off until t j drops by 20c (typical). reverse battery protection circuitry ensures that the device cannot be damaged if the input supply is accidentally reversed, limiting the reverse current to less than 1.5ma. component selection - general output capacitor - semtech recommends a minimum capacitance of 1f at the output with an equivalent series resistance (esr) of < 1 ? over temperature. while the sc1453 has been designed to be used with ceramic capacitors, it does not have to be used with ceramic capacitors, allowing the designer a choice. increasing the bulk capacitance will further reduce output noise and improve the overall transient response. input capacitor - semtech recommends the use of a 1f ceramic capacitor at the input. this allows for the device being some distance from any bulk capacitance on the rail. additionally, input droop due to load transients is reduced, improving overall load transient response. bypass capacitor - semtech recommends the use of a 10nf ceramic capacitor to bypass the bandgap reference. increasing this capacitor to 100nf will further improve power supply rejection and overall output noise. c byp may be omitted if low noise operation is not required. thermal considerations the worst-case power dissipation for this part is given by: () ) max ( q ) max ( in ) max ( out ) min ( out ) max ( in ) max ( d i v i v v p ? + ? ? = (1) for all practical purposes, equation (1) can be reduced to the following expression: () ) max ( out ) min ( out ) max ( in ) max ( d i v v p ? ? = (2) looking at a typical application, 3.3v to 2.8v at 150ma: v in(max) = 3.3 + 5% = 3.465v v out(min) = 2.8v - 2% = 2.744v i out = 150ma t a = 85c
7 ? 2006 semtech corp. www.semtech.com power management sc1453 applications information (cont.) inserting these values into equation (2) gives us: () mw 108 150 . 0 744 . 2 465 . 3 p ) max ( d = ? ? = using this figure, we can calculate the maximum thermal impedance allowable to maintain t j 125c: () () w / c 370 108 . 0 85 125 p t t ) max ( d ) max ( a ) max ( j ) max ( ja = ? = ? = with the standard sot-23-5/tsot-23-5 land pattern shown at the end of this datasheet, and minimum trace widths, the thermal impedance junction to ambient for sc1453isk is 256c/w. thus no additional heatsinking is required for this example. the junction temperature can be reduced further (or higher power dissipation can be allowed) by the use of larger trace widths and connecting pcb copper to the gnd pin (pin 2), which connects directly to the device substrate. adding approximately one square inch of pcb copper to pin 2 will reduce ja to approximately 130c/w and t j(max) for the example above to approximately 100c for the sot-23-5 package. the use of multi layer boards with internal ground/power planes will lower the junction temperature and improve overall output voltage accuracy. layout considerations while layout for linear devices is generally not as critical as for a switching application, careful attention to detail will ensure reliable operation. 1) attaching the part to a larger copper footprint will enable better heat transfer from the device, especially on pcbs where there are internal ground and power planes. 2) place the input, output and bypass capacitors close to the device for optimal transient response and device behaviour. 3) connect all ground connections directly to the ground plane. if there is no ground plane, connect to a common local ground point before connecting to board ground.
8 ? 2006 semtech corp. www.semtech.com power management sc1453 quiescent current vs. junction temperature vs. input voltage off-state quiescent current vs. junction temperature typical characteristics output voltage vs. junction temperature vs. output current line regulation vs. junction temperature vs. input voltage change load regulation vs. junction temperature current limit vs. junction temperature vs. input voltage 0 20 40 60 80 100 120 -50 -25 0 25 50 75 100 125 t j (c) i q (a) i out = 150ma v in = 3.8v v in = 6.5v 0 25 50 75 100 125 150 175 200 -50 -25 0 25 50 75 100 125 t j (c) i q(off) (na) v in = 6.5v v en = 0v -0.30 -0.25 -0.20 -0.15 -0.10 -0.05 0.00 -50 -25 0 25 50 75 100 125 t j (c) v out deviation (%) v in = v out + 1v i out = 1ma i out = 50ma 100ma i out 150ma 0 2 4 6 8 10 12 -50 -25 0 25 50 75 100 125 t j (c) reg line (mv) v in = v out + 1v to 5.5v v in = v out + 1v to 6.5v i out = 1ma 0 1 2 3 4 5 6 7 8 9 10 -50 -25 0 25 50 75 100 125 t j (c) reg load (mv) v in = v out + 1v i out = 0.1ma to 150ma 0.40 0.45 0.50 0.55 0.60 0.65 0.70 0.75 0.80 0.85 0.90 -50 -25 0 25 50 75 100 125 t j (c) i lim (a) v in = 6.5v v in = 3.8v
9 ? 2006 semtech corp. www.semtech.com power management sc1453 dropout voltage vs. junction temperature vs. output current dropout voltage vs. output current vs. junction temperature typical characteristics (cont.) bypass start-up rise time vs. junction temperature vs. input voltage enable input threshold voltage vs. junction temperature vs. input voltage reverse battery protection vs. junction temperature output spectral noise density vs. frequency vs. output voltage, c out = 1f 0 25 50 75 100 125 150 175 200 -50 -25 0 25 50 75 100 125 t j (c) v d (mv) i out = 150ma i out = 50ma 0 25 50 75 100 125 150 175 200 0 25 50 75 100 125 150 i out (ma) v d (mv) top to bottom: t j = 125c t j = 25c t j = -40c 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 -50 -25 0 25 50 75 100 125 t j (c) t r (ms) c byp = 10nf v in = 3.8v v in = 6.5v 0.4 0.6 0.8 1.0 1.2 1.4 1.6 -50 -25 0 25 50 75 100 125 t j (c) v en (v) v ih @ v in = 6.5v v ih @ v in = 3.8v v il @ v in = 6.5v v il @ v in = 3.8v 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 -50 -25 0 25 50 75 100 125 t j (c) i (rev bat) (ma) v in = v en = -6.5v 0.001 0.01 0.1 1 10 0.01 0.1 1 10 100 1000 f (khz) e n (v/ hz) v in = v out + 1v i out = 1ma c in = 1f c byp = 10nf t j = 25c top to bottom: v out = 3.3v v out = 3.0v v out = 2.8v v out = 2.5v v out = 1.8v v out = 1.5v
10 ? 2006 semtech corp. www.semtech.com power management sc1453 output spectral noise density vs. frequency vs. output voltage, c out = 100f output spectral noise density vs. frequency vs. output capacitance typical characteristics (cont.) output spectral noise density vs. frequency vs. bypass capacitance output spectral noise density vs. frequency vs. output current power supply rejection ratio vs. frequency vs. output voltage, c byp = 10nf power supply rejection ratio vs. frequency vs. output voltage, c byp = 100nf 0.001 0.01 0.1 1 10 0.01 0.1 1 10 100 1000 f (khz) e n (v/ hz) v in = v out + 1v i out = 1ma c in = 1f c byp = 10nf t j = 25c top to bottom: v out = 3.3v v out = 3.0v v out = 2.8v v out = 2.5v v out = 1.8v v out = 1.5v 0.001 0.01 0.1 1 10 0.01 0.1 1 10 100 1000 f (khz) e n (v/ hz) v out = 1.5v v in = 2.5v i out = 1ma c byp = 10nf c in = 1f t j = 25c left to right: c out = 100f c out = 44f c out = 22f c out = 10f c out = 1f 0.001 0.01 0.1 1 10 0.01 0.1 1 10 100 1000 f (khz) e n (v/ hz) c byp = 1nf c byp = 10nf c byp = 100nf c byp = 1f v out = 1.5v v in = 2.5v i out = 1ma c in = 1f c out = 1f t j = 25c 0.001 0.01 0.1 1 10 0.01 0.1 1 10 100 1000 f (khz) e n (v/ hz) v out = 1.5v v in = 2.5v c in = 1f c byp = 10nf c out = 1f t j = 25c top to bottom: i out = 150ma i out = 100ma i out = 50ma i out = 1ma 0 10 20 30 40 50 60 70 80 0.01 0.1 1 10 100 1000 f (khz) psrr (db) v in = v out + 1v c in = c out = 1f c byp = 10nf i out = 1ma t j = 25c top to bottom: v out = 1.5v v out = 1.8v v out = 2.5v v out = 2.8v v out = 3.0v v out = 3.3v 0 10 20 30 40 50 60 70 80 0.01 0.1 1 10 100 1000 f (khz) psrr (db) v in = v out + 1v c in = c out = 1f c byp = 100nf i out = 1ma t j = 25c top to bottom: v out = 1.5v v out = 2.5v v out = 1.8v v out = 2.8v v out = 3.0v v out = 3.3v
11 ? 2006 semtech corp. www.semtech.com power management sc1453 evaluation board schematic evaluation board bill of materials y t i t n a u qe c n e r e f e rn o i t p i r c s e d / t r a pr o d n e vs e t o n 24 c , 1 cd e c a l p t o n 23 c , 2 cc i m a r e c f 1a t a r u m0 1 k 5 0 1 r 7 x 6 - 2 4 m r g 15 cc i m a r e c f n 0 1s u o i r a v 11 jt e k c o s c n bs u o i r a vv t u o r o t i n o m e l p p i r 34 j - 2 jn i p t s e ts u o i r a vd e r 15 jn i p t s e ts u o i r a ve t i h w 16 jn i p 2 , r e d a e hs u o i r a v 17 jd e c a l p t o n 26 1 j , 8 jn i p 3 , r e d a e hs u o i r a v 19 jn i p t s e ts u o i r a ve g n a r o 65 1 j - 0 1 jn i p t s e ts u o i r a v) d e c a l p t o n 4 1 j ( k c a l b 11 q0 1 4 4 i sy a h s i v 22 r , 1 rd e c a l p t o n 13 re g a p t x e n e e ss u o i r a v 14 rk 0 1 ? w 0 1 / 1 ,s u o i r a v 11 u r o x . x - k s i 3 5 4 1 c s x x - k s t i 3 5 4 1 c s h c e t m e s c3 r1 c4 c1 c5 c2 r4 u1 sc1453 1 2 3 4 5 in gnd en byp out j6 iq mon 1 2 r3 q1 si4410 1 2 3 4 5 6 7 8 s s s gd d d d j3 in j5 en j2 in mon j14 gnd j13 gnd j4 out mon j12 gnd j11 gnd j10 gnd j9 load drv j15 gnd j1 ripple mon j7 flg r2 j16 load drv en 1 2 3 j8 en 1 2 3
12 ? 2006 semtech corp. www.semtech.com power management sc1453 evaluation board gerber plots top copper bottom copper top silk screen ) v ( n o i t p o e g a t l o v t u p t u oe z i s / e u l a v 3 r 5 . 10 1 ? w 5 . 0 / 8 . 12 1 ? w 5 . 0 / 5 . 26 1 ? w 5 . 0 / 6 . 26 1 ? w 5 . 0 / 7 . 28 1 ? w 5 . 0 / 8 . 28 1 ? w 5 . 0 / 5 8 . 28 1 ? w 5 . 0 / 9 . 28 1 ? w 5 . 0 / 0 . 30 2 ? w 5 . 0 / 1 . 30 2 ? w 5 . 0 / 2 . 32 2 ? w 5 . 0 / 3 . 32 2 ? w 5 . 0 /
13 ? 2006 semtech corp. www.semtech.com power management sc1453 outline drawing - sot-23-5 .110 bsc .037 bsc detail aaa c seating plane c ccc c 2x n/2 tips 2x e/2 5 see detail a1 a a2 bxn d a .008 12 n e1 e d .060 .114 .063 .118 .010 - 5 a 0.20 1.60 3.00 2.80 bsc 0.95 bsc .069 1.50 2.90 .020 0.25 1.75 0.50 - ei l (l1) c 01 0.25 plane gage h 2.80 .110 bbb c a-b d a b e 0 .008 - .004 .012 .003 (.024) .018 - .035 .000 .035 - - .045 0.10 0.20 10 0 - 10 1.15 (0.60) 0.45 .024 .009 0.30 0.08 .057 .051 .006 0.00 .90 0.90 0.22 0.60 - 0.15 1.45 1.30 - - 1.90 bsc .075 bsc dimensions "e1" and "d" do not include mold flash, protrusions datums and to be determined at datum plane or gate burrs. controlling dimensions are in millimeters (angles in degrees). notes: 1. 3. 2. -a- -b- -h- dimensions inches l1 aaa bbb ccc 01 n dim e e1 l e e1 c d a a2 b a1 min nom millimeters nom max min max side view land pattern - sot-23-5 dimensions inches y z dim g p x c millimeters p (c) z y g .043 .141 .055 (.098) .037 .024 1.40 (2.50) 0.95 0.60 1.10 3.60 x dimensions inches y z dim g p x c millimeters this land pattern is for reference purposes only. consult your manufacturing group to ensure your company's manufacturing guidelines are met. notes: 1.
14 ? 2006 semtech corp. www.semtech.com power management sc1453 semtech corporation power management products division 200 flynn road, camarillo, ca 93012 phone: (805)498-2111 fax (805)498-3804 contact information dimensions inches y z dim g p x c millimeters p (c) z y g .055 .141 .031 (.087) .037 .024 0.80 (2.20) 0.95 0.60 1.40 3.60 x this land pattern is for reference purposes only. consult your manufacturing group to ensure your company's manufacturing guidelines are met. notes: 1. dimensions inches y z dim g p x c millimeters land pattern - tsot-23-5 outline drawing - tsot-23-5 .110 bsc .037 bsc detail ccc c 2x n/2 tips 2x e/2 5 see detail a .008 12 n e .060 .114 .063 .118 .012 - 5 a 0.20 1.60 3.00 2.80 bsc 0.95 bsc .067 1.50 2.90 .020 0.30 1.70 0.50 - l (l1) c 01 0.25 plane gage 2.80 .110 0 .010 - .004 .012 .003 (.024) .018 - .028 .000 - - - - 0.10 0.25 8 0 - 8 - (0.60) 0.45 .024 .008 0.30 0.08 .039 .035 .004 0.00 0.70 - 0.20 0.60 - 0.10 1.00 0.90 - - 1.90 bsc .075 bsc seating aaa c bbb c a-b d a bxn a2 a1 d dimensions "e1" and "d" do not include mold flash, protrusions 3. or gate burrs. datums and to be determined at datum plane controlling dimensions are in millimeters (angles in degrees). -b- notes: 1. 2. -a- -h- side view a b d e1 e c h plane e1 reference jedec std mo-193, variation ab. 4. nom inches dimensions l1 ccc aaa bbb 01 n dim c e e1 l e1 e d a1 a2 b a min millimeters max min nom max

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